Wearable Technology

Since the introduction of Artificial Intelligence to the data center, AI has been loath to leave it. With large tracts of floorspace dedicated to servers comprising leading-edge chips that can handle the computational demands for training the latest in AI models, as well as inference via end-user connections to the cloud, data centers are the ideal environment for facilitating much of what AI has to offer.

Spatial computing promises to transform the way people interact with their devices as computing goes truly 3D, with early signs of change already underway. While Apple's upcoming Vision Pro is bringing new excitement to this space, gaming-focused VR (Virtual Reality) headsets from companies including Meta, Sony, and Pico have sold in the millions.

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Sony recently announced 'Project Q', comprising the development of a hand-held PlayStation and corresponding high-end earbuds. The inclusion of earbuds initially seems surprising since headphones and earphones are amongst the most mature in the near hundred billion-dollar wearables market.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

On June 5th, Apple ended years of speculation and finally announced a mixed reality (MR) headset. The US$3499 Vision Pro headset confirmed some expectations and confounded others. IDTechEx has been tracking the mixed, augmented and virtual reality markets since 2015, with reports on headsets and accessories and optics available now and a report on displays for AR/VR soon to be released. This insight into the AR/VR industry and associated technologies provides context to IDTechEx's initial analysis of Apple's headset design philosophy.

Consumer technology available today is impressive but still not as cool as promised by many classic sci-fi movies. Our dreams of hoverboards and holograms have been replaced by stagnating smartphone designs and doom-scrolling. Yet things look set to change.

Thursday 27 April 2023 - What is the status and outlook for the wearables industry as a whole? How do the opportunities and challenges vary between wearable sensors and actuators? How is the role of wearables in healthcare evolving? Why wearables for drug-free health management and which technologies have the most commercial potential?