5G, 6G, RFID & Telecoms

3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.

IDTechEx announces the availability of a new report, "Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts". This new report looks at key market players, emerging materials and technologies, and new applications. Granular 10-year market forecasts are also included.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

Membrane materials are of fundamental importance for fuel cells, even giving their name to the specific type of fuel cell, as is the case for Proton Exchange Membrane (PEM) fuel cells. Typically, these membranes consist of ionomers containing perfluoroalkyl substances (PFAS), which in turn are subject to increasing concern and proposed regulations. In response to this, alternative materials for membranes are beginning to emerge.

The SDV and AI Cars market is set to be worth over US$700 billion by 2034, representing around 20% of the global car market, according to IDTechEx's "Software-Defined Vehicles, Connected Cars, and AI in Cars 2024-2034" report.

IDTechEx Research announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials, and applications of electronics added to 3D surfaces, in-mold electronics (IME), and fully printed 3D electronics.

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

"Forever chemicals", or PFAS, are coming under increasing regulatory pressure globally as concerns over the negative effects of PFAS on human health and the environment are mounting. In their brand new report, "Per- and Polyfluoroalkyl Substances (PFAS) 2024: Emerging Applications, Alternatives, Regulations", IDTechEx dives deeply to explore the future trajectory of PFAS in five key emerging applications: thermal management for data centers, sustainable food packaging, electric vehicles, low-loss materials for 5G, and the hydrogen economy.

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?